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Because of expanding energy intake and part density, localized "hot spots" have gotten a significant problem in IC (integrated circuit) chip layout - so critical, in reality, that Intel lately needed to yank a circuit since it used to be actually burning. For IC engineers grappling with excessive strength dissipation and thermal concerns, new droplet-based cooling ideas utilizing electronic microfluidics expertise may provide the answer. This definitive advisor paves the way in which, with layout and implementation methodologies and prototypes for using this groundbreaking expertise. After reviewing cooling rules and present bulk cooling tools, the e-book brings engineers in control on rising droplet-based architectures. Amply illustrated, this milestone paintings will turn out priceless in tackling IC warmth matters that current equipment can not tackle.
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Additional info for Adaptive Cooling of Integrated Circuits Using Digital Microfluidics
Thus, there remained a technology void and a pressing need for the cooling of ICs in compact packages. Over the past decade, microchannel devices have been developed to miniaturize the cooling hardware. Microchannel cooling loops designed today now have high cooling performance, large heat transfer coefficients, small channel volumes, and a small cooling inventory. The heat transfer in these microfluidic systems begins with an understanding of heat convection between a solid and a moving liquid.
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